InSight WLI
Automated, Gage-Capable Metrology for R&D and Production
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InSight WLI with 300mm Wafer Handler
全自动的Insight WLI系统具有晶圆处理程序集成的无与伦比的光学表面测量功能。Insight WLI从头开始设计，为最苛刻的研发，质量保证和过程质量控制需求，包括Bruker的专利尖端/倾斜头，专有的自我校准激光参考，整合模式认识，以及其他许多其他Bruker--独家干涉测量创新。没有其他计量系统可以为如此广泛的生产计量和成像应用提供非接触式准确性，吞吐量和操作员的便利性。
Особенности
准确性和鲁棒性的基准
- Unique metrology sensor design with patented dual-LED light source
- 自我校准，计量功能优化激光参考
- Integrated vibration-isolation floor-mount cabinet
Measurements & Analysis
最快，最简单的纳米尺度测量
- 全自动测量功能
- Industry leading gage on nanometer-scaled features
Most Powerful Measurement and Analysis
- Streamlined, customizable production interface
- Flexible recipe and automation measurement optimization
- 广泛的过滤器库和可自定义的分析选项
要求要求的配置
Configurations for Demanding Advanced Packaging
- Complete die flatness and CMP metrology solution
- TSV and interconnect measurements
- Hot-spot and defect detection on full reticle die
Factory Automation Ready
- SECS/GEM
- S2/S8 Compliant
- FDC，DCOL可用
Применения
阅读有关使用中WLI计量学的更多信息
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用白光干涉法表征CMP过程(PDF, 4 MB)This application note describes the measurement and analysis advantages that white light interferometry (WLI) offers for the various CMP components. It also details an improvement study that investigated asperity behavior of the fluid layer under the wafer during the CMP process and revealed the effects of polishing and conditioning on the pads, as well as wafer polish results.
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使用非接触式3D光学分析进行全面的晶圆检查(PDF, 3 MB)This application note discusses how 3D optical profiling provides many advantages over other measurement techniques for non-contact inspection of semiconductor packaging front-end process research and control. These advantages range from fully automated measurements and non-destructive inspection to custom analyses and fast measurement speeds.
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用白光干涉法测量表面粗糙度的优点(PDF, 3 MB)This application note discusses the use of mean roughness measurements with white light interferometry (WLI) optical profilers. Spatial filters are explained, as well as some of the normative standards requirements from ASME B46.1-2009, ISO 13565-1 and JIS B 0671-1.3 Main technical reasons for WLI selection are covered as well as the advantages and areas of applicability of the full areal measurement standard from ISO 25178-2.
Поддержка
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