InSight WLI
Automated, Gage-Capable Metrology for R&D and Production
Lo más destacado
InSight WLI with 300mm Wafer Handler
全自动的Insight WLI系统具有晶圆处理程序集成的无与伦比的光学表面测量功能。Insight WLI从头开始设计，为最苛刻的研发，质量保证和过程质量控制需求，包括Bruker的专利尖端/倾斜头，专有的自我校准激光参考，整合模式认识，以及其他许多其他Bruker--独家干涉测量创新。没有其他计量系统可以为如此广泛的生产计量和成像应用提供非接触式准确性，吞吐量和操作员的便利性。
características
Benchmark for Accuracy and Robustness
- Unique metrology sensor design with patented dual-LED light source
- 自我校准，计量功能优化激光参考
- 集成振动 - 隔离地板安装柜
Measurements & Analysis
最快，最简单的纳米尺度测量
- 全自动测量功能
- Industry leading gage on nanometer-scaled features
最强大的测量和分析
- Streamlined, customizable production interface
- 灵活的配方和自动化测量优化
- Extensive library of filters and customizable analysis options
Configurations for Demanding Requirements
要求高级包装的配置
- Complete die flatness and CMP metrology solution
- TSV and interconnect measurements
- 全鞘层的热点和缺陷检测
Factory Automation Ready
- 秒/宝石
- S2 / S8兼容
- FDC, DCOL available
Aplicaciones
Read More About WLI Metrology In Use
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用白光干涉法表征CMP过程（PDF，4 MB）This application note describes the measurement and analysis advantages that white light interferometry (WLI) offers for the various CMP components. It also details an improvement study that investigated asperity behavior of the fluid layer under the wafer during the CMP process and revealed the effects of polishing and conditioning on the pads, as well as wafer polish results.
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使用非接触式3D光学分析进行全面的晶圆检查（PDF，3 MB）This application note discusses how 3D optical profiling provides many advantages over other measurement techniques for non-contact inspection of semiconductor packaging front-end process research and control. These advantages range from fully automated measurements and non-destructive inspection to custom analyses and fast measurement speeds.
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用白光干涉法测量表面粗糙度的优点（PDF，3 MB）该申请说明讨论了使用白光干涉法（WLI）光学剖面仪的平均粗糙度测量方法的使用。解释了空间过滤器，以及ASME B46.1-2009，ISO 13565-1和JIS B 0671-1.3选择WLI选择的一些规范标准要求以及适用于WLI选择的主要技术原因ISO 25178-2的全面测量标准。
Soporte
支持
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