Nanosheet Development
Introduction
Nanosheet Development
Future nodes will implement nanosheet technology. In this technology it is a challenge to measure and control the individual thickness and composition of multiple epitaxial layers.
X-ray Metrology
These Measurements Are Routine on our JVX7300LSI System
The stack is comprised of multiple Si and SiGe layers. Existing HVM metrology cannot easily distinguish the individual layers, but will report an average value.
Thickness and composition of individual layers in blanket, multilayer stack is straightforward by XRR and HRXRD.
- Thickness is measured using X-ray reflectivity (XRR)
- These results are fed-forward into high resolution diffraction (HRXRD) modelling for optimum results
These measurements are routine on our fully automatedJVX7300LSI system.
Structural Analysis of Epitaxial Multi-Layers
X-ray Diffraction (XRD) and X-ray Reflectometry (XRR) are powerful methods for the non-destructive analysis of multi-layered sample structures and deliver highly accurate information on absolute layer thickness, density and composition.
With theD8 DISCOVER FamilyandD8 ADVANCE Plus, Bruker offers a broad range of XRD solutions to address the requirements of the semiconductor market in research and development.
DIFFRAC.LEPTOS、力量强大的薄膜分析套件、紧密相联的ws simultaneous refinement of XRR and HRXRD data to maximize information yield.
Micro-XRF
Micro-XRF
The decreasing thickness of functional layers makes meaningful measurement of the coating thickness a very challenging task.Micro-XRFcan measure thicknesses ranging from single digit nm to tens of micrometers, depending on the present elements. For materials with high sensitivity, even sub-monolayers can be analyzed, with usually the deposited mass per area being measured instead of the thickness.
