Semiconductor Solutions

x射线缺陷检查

Bruker缺陷检测系统使用X射线衍射成像（XRDI）来检测单晶底物上的晶体缺陷，例如裂纹，滑移，脱位和微管。我们的XRDI检查技术无需使用蚀刻酸。这些系统广泛用于检测Si晶片的裂缝，从而导致晶圆破裂并提高其他高价值基板（例如CDTE和SIC）的产量和质量。

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x射线缺陷检查