Tribolab CMP
R＆D规模的过程和材料表征系统
Highlights
Tribolab CMP
Tribolab CMP利用其前身产品（Bruker CP-4）利用20多年的CMP表征专业知识，为行业领先的Tribolab平台带来了完整的功能。最终的准确性和测量可重复性可实现在整个CMP过程中所需的高效资格，检查和持续的功能测试。Tribolab CMP是市场上唯一可以提供广泛抛光压力（0.05-50 psi），速度（1至500 rpm），摩擦，声学排放和表面温度测量的速度范围的工艺开发工具，以准确而完整地表征CMP流程和消耗品。
无与伦比
小型研发系统中的ROI
This benchtop tool reproduces full-scale wafer polishing process conditions without downtime on production equipment.
灵活的
parameter control
Allows tailored testing to accelerate materials development and refine processes with accuracy.
专家
申请和支持
我们与大型安装基础合作的多年来为您的实验室提供了专业知识。
特征
Small R&D-Scale Specialty System for CMP
布鲁克’s TriboLab CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost-effective bench characterization of wafer polishing processes.
- 复制全面的晶圆抛光过程条件，而无需停机的生产设备
- Provides unmatched measurement repeatability and detail
- 允许测试小优惠券大有限公司st savings over whole-wafer testing
On-Board Diagnostics for Better Understanding of Polishing Processes
在Tribolab CMP测试仪上测试调节光盘。测试识别两组光盘。摩擦系数测试与PAD磨损相关。
- 与市场上的任何其他系统相比，对瞬态抛光属性的可见性更大
- Collects data from the instant the substrate touches the pad and throughout the entire test
- Enables early-stage process development decisions through more complete, detailed data
Flexibility in Sample Type, Size, and Mounting Configurations
- Polishes any flat material, using virtually any conditioning disc, any slurry, and any pad
- Accommodates small coupons through whole 100 mm wafers with ease
- Accepts multiple sample mounts for flexibility
调节垫测试的CMP测试仪的示意图。