Tribolab CMP
R&D-scale process and material characterization system
Highlights
Tribolab CMP
Tribolab CMP利用其前身产品（Bruker CP-4）利用20多年的CMP表征专业知识，为行业领先的Tribolab平台带来了完整的功能。最终的准确性和测量可重复性可实现在整个CMP过程中所需的高效资格，检查和持续的功能测试。Tribolab CMP是市场上唯一可以提供广泛抛光压力（0.05-50 psi），速度（1至500 rpm），摩擦，声学排放和表面温度测量的速度范围的工艺开发工具，以准确而完整地表征CMP流程和消耗品。
无与伦比
ROI in a small-scale R&D system
This benchtop tool reproduces full-scale wafer polishing process conditions without downtime on production equipment.
灵活的
parameter control
Allows tailored testing to accelerate materials development and refine processes with accuracy.
Expert
applications and support
我们与大型安装基础合作的多年来为您的实验室提供了专业知识。
Eigenschaften
Small R&D-Scale Specialty System for CMP
Bruker’s TriboLab CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost-effective bench characterization of wafer polishing processes.
- Reproduces full-scale wafer polishing process conditions without downtime on production equipment
- Provides unmatched measurement repeatability and detail
- Allows testing on small coupons for substantial cost savings over whole-wafer testing
On-Board Diagnostics for Better Understanding of Polishing Processes
在Tribolab CMP测试仪上测试调节盘。测试识别两组光盘。摩擦系数测试与PAD磨损相关。
- 与市场上的任何其他系统相比，对瞬态抛光属性的可见性更大
- Collects data from the instant the substrate touches the pad and throughout the entire test
- Enables early-stage process development decisions through more complete, detailed data
Flexibility in Sample Type, Size, and Mounting Configurations
- Polishes any flat material, using virtually any conditioning disc, any slurry, and any pad
- Accommodates small coupons through whole 100 mm wafers with ease
- Accepts multiple sample mounts for flexibility
调节垫测试的CMP测试仪的示意图。