Press Release Details

Large-Format Metrology System Debuts to Over $5 Millionin Orders

BILLERICA, Mass.--(BUSINESS WIRE)-- Bruker Corporation(NASDAQ: BRKR) today announced that it has launched theContourSPlarge panel metrology system, which more than doubles the measurement throughput of the high-density interconnect (HDI) substrates in multi-chip modules (MCM) over previous generation SP models used by the semiconductor packaging industry. Specifically designed to measure each layer of the printed circuit board (PCB) panels during manufacturing, the gage-capableContourSPassures the minimum recipe development time, highest yield, maximum up-time, and lowest cost per measured panel in production. These features have already led to over $5 millionin orders by several leading HDI/MCM PCB manufacturers.

“Demand for Bruker’s fifth generation SP model continues to build as early adoption customers enjoy the advanced capabilities and ease of use offered by theContourSP,” said 马克·r·蒙克, Ph.D., President of the Bruker MAT Group. “By doubling the throughput and adding new proprietary measurement capabilities, our customers are able to achieve maximum productivity in this era of ever smaller line widths and tighter tolerances in the PCB industry.”

“Not only is theContourSPmuch faster than other systems at performing these precise measurements, but we have added a number of productivity enhancing features,” added Kent Heath, Senior Director of Marketing for Bruker’s Stylus and Optical Business. “The new Vision64® operator interface with multi-processing features multi-region analysis, automatic re-measurement, and our proprietary Dynamic Signal Segmentation (DSS) analysis, making theContourSPthe most comprehensive tool available.”

AboutContourSP
Based on white light interferometry, theContourSPincorporates decades of packaging and panel measurement experience to provide unprecedented speed, metrology capability, reliability, serviceability, and manufacturing readiness for 3D critical dimension measurements in MCM and HDI PCB applications. Bruker’s high-performance 3D optical microscopes feature Vision64 operating and analysis software, and the industry's most intuitive, modular user interface to deliver user-level-customization capabilities for the widest possible range of surface profiling metrology applications. TheContourSPalso utilizes Bruker’s revolutionary gantry-based design and integrated workstation to support up to 600x600-millimeter samples in a highly compact footprint.

About Bruker Corporation(NASDAQ: BRKR)
Brukeris a leading provider of high-performance scientific instruments and solutions for molecular and materials research, as well as for diagnostics, industrial and applied analysis. For more information, please visitwww.energie2point0.com.

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Source: Bruker Corporation